Add a note to your Bill of Materials (BoM) stating: "All vias under BGAs and CSPs must be filled and capped per IPC-7095E Section 4.5.2." This forces your PCB fabricator to use the correct process.

: The document offers detailed information on the design, materials, and manufacturing processes for CSAs, helping designers and manufacturers to produce high-quality assemblies.

, it is a copyrighted technical document. To ensure you have the most accurate, legal, and up-to-date version, it should be purchased directly through the

To convince you of the value of the legitimate document, here is a breakdown of the most referenced sections of the standard.

Since BGA joints are hidden, the standard focuses heavily on X-ray inspection and endoscopic techniques for quality verification.

Guidelines for designing PCBs (Printed Circuit Boards) that are compatible with these advanced packaging technologies. This involves considerations for pad layouts, trace routing, and via placement to ensure reliable solder joints and optimal electrical performance.