This consolidation was driven by two major industry shifts: the move from solvent-based to water-based (aqueous) cleaning and the transition to . Higher reflow temperatures used in lead-free processes have fundamentally changed the nature of solder residues, making them more difficult to remove and necessitating updated guidance. Key Content of the IPC-CH-65B PDF
IPC-CH-65 PDF – Guidelines for Cleaning Electronic Assemblies ipc-ch-65 pdf